Nanofabrication Techniques

Step 1: Understand the question.
The process described refers to a thin film deposition technique where growth species are deposited in a controlled manner, one atomic layer at a time. This process is known as Atomic Layer Deposition (ALD).
Final Answer:

Step 1: Understanding EUV lithography.
EUV lithography is a next-generation technology used in semiconductor manufacturing, and it operates at a wavelength of 13.5 nm, enabling the creation of smaller features on chips.

Step 2: Conclusion.
Thus, the correct wavelength used in EUV lithography is 13.5 nm, so the answer is option (1).

Step 1: Understand the process of MOSFET fabrication.
The fabrication of a MOSFET involves several key steps that need to be followed in a particular sequence to ensure proper functioning of the transistor. Each of these steps plays a crucial role in forming the MOSFET structure.

Step 2: Order of steps.
- Metallization (A): Metallization is the process of applying metal layers for interconnections. It is typically the first step after the formation of the wafer, as these metal contacts are needed to make electrical connections between the different components of the MOSFET.
- Oxidation (B): The next step involves oxidizing the silicon wafer to form a layer of silicon dioxide, which is used as an insulating layer. This layer is essential for forming the gate dielectric in a MOSFET. It comes before etching and doping steps.
- Etching (C): Etching is used to define patterns on the wafer, particularly for the gate structure and other components of the MOSFET. After oxidation, this step shapes the areas where different materials will be deposited or removed.
- Diffusion/Ion implantation (D): Diffusion or ion implantation is the final step in the fabrication process where dopants are introduced into the semiconductor material to create regions with different electrical properties (e.g., n-type or p-type regions). This step usually comes last to define the transistor's source, drain, and channel regions.

Step 3: Final Answer.
Thus, the correct sequence of MOSFET fabrication steps is:
1. Metallization (A)
2. Oxidation (B)
3. Etching (C)
4. Diffusion/Ion implantation (D)

Final Answer: